Does the other packages give you this ability? The other fine pitch parts are also very difficult to change over.
This form factor has a huge advantage for OEMs - they can just slap on a single chip that has everything built in - controller, memory management and the actual storage. Less parts = less convoluted assembly process and that is cheaper. While theoretically you can put a BGA fully integrated SSD SOC like this on a PCI-E card or M2 etc., it kinda beats the purpose.
I did my early engineering years with DIP parts, the days of when you could just desolder the memory device and place with a higher density device are long gone.