Anyone familiar with J-Core able to expand on the how an audit would be done end-to-end?
Seems like it would be much harder to do in practice than in theory.
Anyone familiar with J-Core able to expand on the how an audit would be done end-to-end?
Seems like it would be much harder to do in practice than in theory.
It's harder to audit ASICs that other people have had fabricated without having the exact same standard cell libraries, tooling versions (optimisations change over time), knowing what optimisation settings they used, etc. to be able to prove the masks came from the same code.
I say probably because it's possible that advanced actors like the USA and China have developed tools that add features (backdoors) while making the visual layout look very similar. Then you would probably only find the backdoors by "fuzzing" the chip like you would a piece of software.
Iirc, there was a group from the CCC working on using image recognition algorithms to extract netlists from decapped chips. I'll have to look that up...
And many foundries themselves outsource masks due to equipment costs.
You might be able to get away with a strict characterization of the diced chips to give yourself a very high likelyhood that different die were not substituted at the packaging step. You could also decap a random selection of chips coming back from the factory to validate they used your die rather than a different one.