Okay, I think we're talking past each other at this point so let me be as clear as possible: the original comparison was between TSVs and logic in DRAM. Both of these are a way to get DRAM on chip and as physically close to the core logic as possible. Logic in memory is on die, while TSVs are on package; neither can be "extended" by an end-user without connecting off chip. Neither changes the physical package size very much (TSVs are not intrinsically bigger than logic in DRAM). Both have nothing to do with off chip connections; as soon as you start talking about things happening off package they behave identically (grids of processor/DRAM combos can be done with either in exactly the same way). Any chip you like can have TSVs (many core, single core, big, small, whatever); there's​ no architecture that logic in DRAM can have that TSVs can't. Both can be used to "split up processing to where the memory is". Neither has to be a "fat node".

So with that out of the way, what exactly is the advantage of logic in memory? Because so far nothing you have described is actually an intrinsic advantage.