Features lists generally include the transistor gate pitch, interconnect pitch, transistor fin pitch, and transistor fin height. None of these features are actually "10nm" or "7nm, but range anywhere between 30nm-60nm. Although sources are conflicting online, it looks like Intel 10nm is about on par with TSMC 7nm. Some features for Intel's 10nm are larger, while others are smaller than TSMC 7nm. Also _most_ sites are saying Intel 10nm has a higher transistor density, but information is kind of flaky on this metric.
You get something that physically is very clearly defined but in practice it's not. Just like the minimum feature size which doesn't tell you much about the rest of the transistor. Perhaps if they used an average feature size it would make more sense for the regular person.
So how are the fabrication sizes different from the frequency that gets advertised on the box? "Oh that? It's only when you load one core. And don't run anything using these specific instructions. And when the temperature isn't too high. And...".
So no matter how you slice it Intel has fallen behind.
You can see this with Intel right now: CannonLake (10nm) has been delayed due to yield issues but KabyLake, Coffee Lake & Whiskey Lake (14nm) are all improvements over the original 14nm product (Skylake).
Or at least that's how I understand it. At the end of the day the chips are now physcially small enough to do whatever we want so it's more useful to directly compare power consumption rather than the implementation details. After all, if a 10nm Intel chip can give you the same output per joule and per second as a 7nm Apple chip, does it really matter how big the transistors are?