https://images.anandtech.com/doci/13829/cpu44.jpg
Maybe a second Zen2 die?
https://images.anandtech.com/doci/13829/cpu44.jpg
Maybe a second Zen2 die?
Taken from: https://www.pcworld.com/article/3332205/amd/amd-ceo-lisa-su-...
When Rome was presented last year users also speculated about GPU and FPGA chiplets. Playstation 5 rumors also speculate about chiplets to keep the price to performance ratio as low as possible (though I wonder about latency which games are sensitiv to). So going all in on chiplets and reusing them for everything would make sense for AMD.
Seems possible to put 2 dies there with lower core counts to be able to use the chips (eg 4 + 4). As you say, it's also possible for 8 + 8, and probably 6 + 6 combinations. Also possible to put a GPU there for their G series.
Think of 3+1GB of scratch memory or L4, this could feed a GPU and not compete with main memory access. Or for notebook or game use, it would need less 100 active pins, vastly simplifying pcb design and costs.
This leaves a lot of guesswork. Intel has to be prepared for multi-chip, chip + CPU, faster chips, slower chips (maybe this was a golden sample), etc which makes it much harder to adjust in preparation.
You'd see the vias for the empty chip if it were planned to share the interposer among chip combination SKUs.