What you're trying to do (as he stated in the article) is that you're trying to reflow the poorly adherent solder beads in the hopes that you'll fix the faulty connection. But the way you're doing it introduces the risk of damaging the PCB and the ICs themselves through thermal stresses and gaseous expansion by any trapped ambient moisture. This will irreparably damage your board and it will lead to the phenomena he experienced here. ("popcorning")
The right way to do it involves a directed hot air gun and proper equipment so that you aren't imposing excessive thermal stresses onto the board as a whole. If you don't know how to do that, then please send it to someone who does. There are several good repair outfits out there right now who specialize in this and can help you out.
Do not repeat this person's mistake. This DIY method is like doing cardiac surgery with a chainsaw. It's a terrible idea for your data and wallet.
Edit: Here's a guide that outlines these issues and offers ways to do it properly with the right equipment. The "popcorning" is called board delamination. https://www.latticesemi.com/-/media/LatticeSemi/Documents/Ap...