New backend house company opening, TSMC fab 18 and upgrades at few minor fabbers.
If you take fab 18 and ardentec away, you will see that Taiwan did not reverse the trend, and semi spend keeps going down industry wide for 4th year straight.
If you take fab 18 and ardentec away, you will see that Taiwan did not reverse the trend, and semi spend keeps going down industry wide for 4th year straight.
We're definitely hitting a silicon bottleneck, the physical barriers are very real, and exceedingly costly to attempt to work around. AMD's strategy of using 14nm chiplets for components that don't scale down well (eg: analog interfaces, DRAM, etc) is likely to become much more common.
[1]https://en.wikichip.org/wiki/amd/microarchitectures/zen%2B