The popular thing to talk about in the rumor mills has been if they continue to make it any wider SMT4 as seen in Power may come about.
Personally I think the IO die has the best chance for improvements though, especially towards EPYC parts which have up to 8 CCXs and a crazy memory controller to interconnect.
Definitely agree on the IO die. Not sure what plan AMD has with IO die, currently it is on 14nm only to use up all the Wafer Agreement that had with GF, and we are not sure how long that agreement last or if it makes sense to switch the IO die to FD-SOI which is GF's forte at the moment.
But like Dr Lisa Su had said, it is important to shown their clients that they stick to their roadmap and execute it to perfection. Something Intel hasn't been doing for the past 3- 4 years.