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The main technical surprise to me from your pitch is the integration of power electronics and motor in one package. Your windings, at 96.7% efficiency and 200 kW, need to dissipate 6.6 kW of heat. Your SiC FETs are more efficient and therefore produce less heat, and while they can take high temps, are more efficient at lower temperatures. Why not connect the inverter to the motor with a short cable, and package those separately?

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Tight integration removes an entire housing and cold plate from the inverter design (++ specific power). Allowable SiC die temperatures are ~175 C these days, which is pretty awesome.

The inverter and motor are on opposite sides of the coolant, and so heat from each flows into the coolant. The mechanism by which the motor would heat the power electronics is via increasing the coolant temperature, which to some extent is mitigated by maintaining an appropriate flow rate given the loading conditions.

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