Photographing a Raspberry Pi 2 with Xenon flash makes it power down (2015)

The reason could be the same as given in the other RPi post today (about the Pi Zero 2W):

> The black rectangle is a "bare-die soldered bumped package"... what that means is the silicon die has no black epoxy covering. A metal layer is deposited on the die and then solder bumps attached which allow the part to be soldered to a PCB. The reason for this, is as expected, cost. No package (epoxy, substrate)... no cost. One sees this more-and more with electronic assemblies.

> The only downside is that external light can actually affect the chip operation (light hitting the die releases electrons at PN junctions creating errors in circuit operation ) .. .however here the Faraday metal shield helps prevent this.

http://electronupdate.blogspot.com/2021/11/raspberry-pi-zero...

Curious, were they successfully able to make future Pis immune to this?

Previously here: https://news.ycombinator.com/item?id=24818232 (3 comments)

(2015)