Abbreviations and some comments for those who are not quite familiar with electronics:

BGA - Ball Grid Array[0], a way to mount integrated circuits (IC) to a printed circuit board (PCB)[1].

TSSOP - Thin-shrink small outline package[2], a form factor of ICs

8L design - this means the PCB has eight layers, with some being ground planes (that usually are just complete layers of copper and thereby also spread heat which complicates heating up a component for (de)soldering).

SMD - surface-mount device[3], the small form factor for electronics parts that go directly onto a PCB, instead of e.g. bulky resistors with wires coming out of them that are then threaded through holes before being soldered on.

[0] https://en.m.wikipedia.org/wiki/Ball_grid_array

[1] https://en.m.wikipedia.org/wiki/Printed_circuit_board

[2] https://en.m.wikipedia.org/wiki/Small_outline_integrated_cir...

[3] https://en.m.wikipedia.org/wiki/Surface-mount_technology