how do we cool all of the layers though? with single layer it’s easy, we just need to cover the top surface. With a 3d structure how can we do it efficiently? micro fluids ?
That could be part of the reason why 85% drop in power consumption only leads to twice the perfomance.
Even this will be used in multi layers, like current chips. Aren't they already multi layer?
Cooling heatpipes going through the chips? I was wondering the same for 3D stacked nand, but in that case the thermal output could be so low that you might not need to.
Maybe alternate each computing layer with a cooling layer made from gold (with holes for wires obviously).