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Comment by hazza_n_dazza | Hacker News Reader

Some sources, you might want to move the heat away (ie, CPU), maybe these loads of pipes they have are the same. But yes, point taken, insulation first. Ockhams Razor: don't multiply entities beyond necessity.

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But if you want to move the heat away from a CPU, wouldn't you want to pump more electricity into the Peliter element to move heat away faster?

On a High-End Desktop Chip? YES! Intel made such a cooler recently[1]. But on mobile/low power devices it might be worthwhile to have them run a little warmer (within spec) but take the heat energy back via a peltier element. Would be interesting to see such an element directly on die feeding back into the chip directly, sort of an electric rebreather for a chip.

[1] https://www.intel.com/content/www/us/en/support/articles/000...

Occam's Razor: no need for the K or H. Just double the C.

Ockham is a totally acceptable spelling which requires all three: C, K and H...

See: https://en.wikipedia.org/wiki/Occam's_razor https://en.wikipedia.org/wiki/William_of_Ockham

I suppose though in the case of the CPU the metric you want to maximise is the heat dispersal not electricity produced.

Could work well on things like exhaust pipes

If it works, I think the waste heat from server farms should be the first target.

Yes that'd be good. The figure I'd like to know (maybe I missed it) is how much it reduces the heat by

It seems like the devices would insulate the server-farm. That might not be worth it, because you'd need extra cooling to offset the higher insulation.

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