Planning on spending the next two years getting up to speed so I can navigate the field from an investment standpoint
Do not forget that although H&P will cover architecture, today architecture is done from the behavioral level down, e.g. they design what they want the chip to do, synthesize that in some Hardware Description Language (HDL, like Verilog or VHDL) and then they have a huge team of engineers who will optimize parts of that, as the synthesis is not totally optimized. Then on top of that, another team of engineers will optimize each component or module for speed by sizing the transistors appropriately.
I am going to admit, I know from a hand-waving level end to end manufacturing, so I could not point you at a very good resource for understanding the actual "boots on the ground" process of today's lithography. Again, in Rabaeys 3D IC book there are great sections on the processing of 3D ICs which would give you some insight into the process today.
Hope that helps some.