> Second, the recourse to two M1 Max chips fused into a M1 Ultra means TSMC’s 5 nm process has reached its upper limit. It also means TSMC’s 3 nm process isn’t ready, probably not shipping until late 2022. Apple, by virtue of their tight partnership with TSMC has known about and taken precautions against the 3 nm schedule, hence the initially undisclosed M1 Max UltraFusion design wrinkle, likely an early 2021 decision.
"recourse"... "design wrinkle"... wouldn't something like UltraFusion be an architectural goal at the outset, rather than something grafted on later? Feels pretty fundamental.
I have a vague memory that AMD has/had something similar -- the idea what their entire range would be the same basic core, fused together into larger and larger configurations. Seems like a smart move to concentrate engineering effort. But chip design not even slightly my area.