X-ray tech that reveals chip designs
spectrum.ieee.org
spectrum.ieee.org
https://sharps.org/wp-content/uploads/BECKER-CHES.pdf
https://en.wikipedia.org/wiki/Doping_(semiconductor)
In this paper we introduced a new type of sub-transistor level hardware Trojan that only requires modification of the dopant masks. No additional transistors or gates are added and no other layout mask needs to be modified. Since only changes to the metal, polysilicion or active area can be reliably detected with optical inspection, our dopant Trojans are immune to optical inspection, one of the most important Trojan detection mechanism. Also, without the ability to use optical inspection to distinguish Trojan-free from Trojan designs, it is very difficult to find a chip that can serve as a golden chip, which is needed by most post-manufacturing Trojan detection mechanisms. To demonstrate the feasibility of these Trojans in a real world scenario and to show that they can also defeat functional testing, we presented two case studies. The first case study targeted a design based on Intel’s secure RNG design. The Trojan enabled the owner of the Trojan to break any key generated by this RNG. Nevertheless, the Trojan passes the functional testing procedure recommended by Intel for its RNG design as well as the NIST random number test suite. This shows that the dopant Trojan can be used to compromise the security of a meaningful real-world target while avoiding detection by functional testing as well as Trojan detection mechanisms.
That is, of course, assuming you fully trust the software running on the x-ray scanners :-)
Really exciting to see these tools come into existence though. Just the fact that they exist can be an excellent deterrent against any sort of malicious hardware tampering at scale. Hopefully the tech eventually gets democratized enough that civil rights groups can do random audits on consumer devices at regular intervals.
It's not a trade secret once you give it away to millions of customers. Though I'm sure that, as we speak, they're lobbying to make it illegal to use information you'd get from all but the most surface-level, unaided inspection of a product. It'll probably come in one of those "free trade" agreements.
The threat they are trying to deal with is a fab modifying the silicon and introducing additional logic during production. The issue that I see is the most likely place that behavior would be inserted is inside the PDK, so even if you can compare what it should output vs what’s produced, it would match.
The other issue is even if you compare something that generates the exact same transistors… if you produce at Fab A and Fab B, the silicon is going to be different.
The voxel size in the linked publication is 19 nm, which is ~50 times (!) smaller than 1 μm, a mind-blowing resolution. (Even for me, which had the pleasure to meet Gabriel Aeppli in person as part of my PostDoc at the institution where he works.)
[1]: If you have access to the machines.
Whether or not you can use X-ray or other probing techniques to find the current state of a cell of flash memory is a different question.
Laser blown fuses are also common.
OTOH, I think it changes the landscape for smart card secret extraction as it means you can get a full layout of the counter measures before attacking the chip...
That said, this tech doesn't look to be sufficient on its own. You probably need to analyze the contents of a chip, not just its structure. The linked article just describes an improvement in learning some kinds of physical structure.
> That said, this tech doesn't look to be sufficient on its own. You probably need to analyze the contents of a chip, not just its structure.
Those two statements appear to be contradictory. Could you clarify what you mean by them and in particular what you mean by the "contents" of a chip ?
I know that low voltage SEM used to be capable of seeing voltage differences in chips but I have no idea if that's still feasible with the scale of today's technology (resolution tends to be worse at lower beam voltages) and the physical basis for flash memory.
> Contradictory
One statement is that if you control a chip you can produce the stated information eventually. The details are an engineering problem. The other statement is that this particular instance of engineering doesn't suffice I don't think.
> SEM
I'd be inclined to use EFM instead. Its resolution should suffice for the next few generations of chips.
you could make a fly-through tour through its inner workings to make sure everything is really in its proper place
That reminds me of one of the ideas I've had in the back of my mind for a while but never had a chance to do anything with --- turn a chip layout into a VR map.