What you did was reflow the solder. This isn’t an uncommon technique for amateur/small batch repairs or assembly of surface mount circuit boards. At the maker space I use, there’s a toaster oven dedicated to this task.

That being said, you don’t want to use that oven for food purposes anymore. Lots of toxic chemicals will off-gas in the reflow process.

ETA this reminds me of the Xbox 360 “red ring of death” fiasco. One DIY repair technique was to wrap the entire Xbox in towels blocking all the ventilation. The theory was the resulting overheating would reflow the failing BGA solder joints. I don’t know if this really worked or was anecdotal but it was one I remember seeing a lot.