I agree. And part of the magic comes from ASML.
It is entirely plausible TSMC co-developed some of ASML’s IP and has exclusivity - or that the tech to make a working process out of ASML machines is intrinsically hard.
They're the only ones that make EUV lithography equipment. Competitors (Canon, Nikon) tapped out at DUV.
HAP GmbH Dresden, MBFZ Toolcraft GmbH, Corning Advanced Optics, AGC Inc, RUAG Space, Schmolz + Bickenbach, RORZE CORPORATION and GEWO Feinmechanik GmbH