That's pretty much inevitable I think when chasing density.
Why can't we have both? L4 cache anyone?
There are chances that in the future data centers the DIMM sockets from the CPU boards will be replaced by a combination of soldered DRAM on the CPU boards, for the lowest latency, combined with separate memory boards attached to the CPU through CXL links, for high capacity memories that can be allocated flexibly to the CPU boards, and that can be replaced or expanded independently of the CPUs.
Intel has already shown Sapphire Rapids samples with 64 GB of HBM 2e [1]. It's a safe bet that the HBM is not exclusive with external main memory. That'll be DDR5 of course, not CXL. Maybe in the 5th gen?