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Intel aims to achieve 1T transistors on a package by 2030 using chiplets | Hacker News Reader

Intel aims to achieve 1T transistors on a package by 2030 using chiplets

techspot.com

2 points·Zuider··4 comments

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I smell yummie fumes of glue!

cf. (·) https://duckduckgo.com/?q=intel+vs.+amd+'glued+together'

Resentfully yours ;->

Will they be shock-proof or of course they will not?

So you could drop your laptop, only to find lots of little wafers spilling out of the fan vents?

This works slightly different. One pin may be enough, several pins is enough always.

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