The question after your talk implied that DIMM training was still being done by non-Oxide software.
The question after your talk implied that DIMM training was still being done by non-Oxide software.
More generally, we have implemented and opened everything we can; there still remain opaque bits like the PSP, as well as some smaller bits scattered through the machine (e.g., SSD firmware, MCU boot ROMs, VR firmware, etc.). We have endeavored to make as open a system as possible within the constraint of not making our own silicon. And while we haven't talked about it publicly, we will also open our schematics when we ship the rack, allowing everyone to see every component in the BOM. While we do have some (necessary) proprietary blobs in the system, we want to at least be transparant about where they are!
Is changing that on your roadmap?