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The article says:

> The chip is being manufactured by Globalfoundries on the 12-nanometer low-power process.

As far as I can tell it is not radiation hardened yet. I think what the article is trying to say is that since it is an open source hardware, ESA is not dependent on the vendor for radiation hardening.

Glofo 12nm is an FD-SOI process, which is inherently less sensitive to radiation than normal bulk CMOS. Since the substrate is an isolator SOI devices are also generally immune to latchup.

Globalfoundaries 12nm, hardening not reported.

"The chip is being manufactured by Globalfoundries on the 12-nanometer low-power process."

Pack it inside lead?