Consider however that 7 nm (TSMC N7, Intel 10ESF/Intel 7, Samsung 8/7 nm) is universally a DUV (193 nm light) process using multipatterning. The nodes below are universally EUV. That's a step-change in complexity. If "The West" manages to contain EUV to friendly countries, then it doesn't seem unlikely to me at all that Chinese semiconductors will run into the EUV wall and get stuck for a significant amount of time trying to get over it.