I think if TW standards is good enough to build 3nm chips on an earth quake zone, it's good enough for US. We're talking about building leading edge semi conductor not housing, which granted TW is hilariously bad at.
Apparently that is not what the regulations say? I don't think us employees / employers are able to go against the regulations without legal consequences.
I'm more addressing the point that US building regulations (when it comes to fabs) has "higher standards" vs just being more onerous. Which your second sentence in original point addressed but I missed.