I didn't notice this was the table since you didn't attribute the source and it wasn't spaced visually.

A table on https://en.wikipedia.org/wiki/2_nm_process suggests:

'20 angstrom (Intel)' ~= 2 nanometer (industry)

    Process  Gate      Metal     Year
    7 nm     60 nm     40 nm     2018
    5 nm     51 nm     30 nm     2020
    3 nm     48 nm     24 nm     2022
    2 nm     45 nm     20 nm     2024
    1 nm     42 nm     16 nm     2026 

However note that the feature size barely shrinks between 2 nm and 1nm. I'm not sure what size Intel will go with, but offhand this might be close to the limits of silicon as we know it. I'm not sure where things will get pushed in the quest for further progression.

Also of note, IIRC some of AMD's presentations around when Ryzen launched involved mention that cache / memory (and maybe some other features?) on CPUs weren't scaling down effectively past 7 ~ 5 nm, which is one of the reasons GPUs had the cores and then external memory controllers. I know automakers and a bunch of other consumers that would like bulk (cheap) products made on modern wafers (300mm) with a semi-modern process that's super inexpensive. Particularly power ICs which would prefer lower leakage even if it means a slower response.