I've also built a camera, with the BGA/sensor mounted directly on my board, with good old CHMT36VA. With a double-sided PCB this was pushing the limits of both OSHPark manufacturing process and PCB/chip alignment during pick & place. Initially my yield was around 50% :-/
And the sunlight issues were instant and horrible problem. Unlike your aluminum casing, initially, my was SLA printed - transparent across the spectrum. Including the camera box. Regardless of what I've tried (for example, two layers - metallic coating and pure black paint that telescope enthusiast are using), I couldn't get rid of some level of sunlight effects.
Regretfully, had to shelf this project :-/. AI started exploding and playing with camera designs suddenly became less of a focus.