- Base Tile -> Intel 16
- Compute Tile -> Intel 4
- SOC Tile -> TSMC N6
- I/O Extender Tile -> TSMC N6
- Graphics Tile -> TSMC N5
Lunar Lake:
- Base Tile -> Intel 16
- Compute Tile -> TSMC N3B
- Platform Controller Tile -> TSMC N6
The article makes it sound like for Arrow Lake, EVERYTHING, including the Base Tile, will be made by TSMC, and then Intel will just glue everything together into the CPU package.
Its fabrication is much simpler than that of the other tiles and it belongs to the packaging and testing operations, which are done by Intel itself.
It does not belong to the fabrication of the active parts of the CPU SoC. The Base Tile could have been fabricated by any from more than a dozen of IC manufacturers, while the active tiles are beyond the capabilities of any company besides TSMC, Samsung and Intel.
The Base Tile is just "glue" for the tiles that contain the active devices.