What Pat said is 100% correct. The actual manufacturing of EUV ICs is incredible difficult, only eclipsed by the difficulty of figuring out HOW to do it. Doing the fabrication here in the US is great, but the much more difficult and key skill is the 'figuring how to do it'. Modern EUV is unbelievably complicated, and there are a continuous supply of new engineering problems that at first glance often don't even appear to be solvable.
In many cases you have an idea and it take 2-3 weeks to determine if it made any difference, and the feedback loop just gets slower after that. The steps in EUV requires some extreme engineering, and it is that core engineering talent you want to develop. The fabs are complicated, but the recipe is the key.
(Note I worked at Intel in the 90s, funny enough in Pat's group)