The data sheets for WLCSP parts specify that the part is photosensitive and often give data on how light can affect the part.
This has been known since the inception of WLCSP, and is treated as a design parameter by responsible engineers.
Chip manufacturers know that bare silicon chips are light sensitive, they are literally made of thousands/millions/billions of tiny solar panel junctions. CMOS imaging tech evolved from exposing cmos memory chips to a focused image. WLCSP chips are basically unpackaged silicon chips.
None of this is a “discovery”. People have been decapoing transistors to use them as photodetectors or solar cells since people started putting metal covers on transistors to protect them from light interference. Early photo transistors were a standard npn part with a windowed can.
If you put WLCSP parts on a PCB that will be unprotected, and photosensitivity is not an acceptable design feature, you are either a hack, or making mistakes like a NOOB and should be supervised by a senior engineer.
It’s called reading the data sheet, before integrating a part into millions of devices. Maybe understanding what a silicon chip is made of and how semiconductor junctions work. It’s a basic engineering responsibility, and failing to do so is an abdication of your duties and responsibilities as an engineer.
Anyway, cool story except I get the definite feel that the article was written or heavily influenced by LLM output, by the pedantic cadence and constant summarization.