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There is LPCAMM2, if manufacturers want to use it.

So, it does not have to be soldered.

LPCAMM2 is available in real systems at 7467MT/s and 120ns latency, vs apple (and intel) at 9600MT/s (and apple soldered memory at 100ns latency).

I don't know how linear or sensitive CPU and GPU benchmarks are to such a 20% slowdown, but i don't think Apple wants to pay it. And it looks like the next generation will be even closer to the SOC.

LPCAMM2 is also brand new. It likely will improve a lot.

We're also hitting the limit of DDR5 here (before moving to multiplexed)

I would guess if you had LPCAMM2 located physically around the CPU (one or two on each of the 4 CPU edges) you could also reduce that latency.

Its still further away than the Ram on a packaged CPU and latency is limited by speed of light/electrons on that scale.

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