1. Do you fabricate in-house, or through partner fabs? If partners, where are they located?

2. Can you do 6-layer 1+4+1 HDI - laser microvias (0.100 mm), stacked microvias over buried vias, sequential lamination?

3. Can you do via-in-pad fill and planarize (Type VII / VIPPO)? I have ~218 vias on one board needing it.

4. What's your minimum copper-to-copper clearance? Can you do 0.075 mm with a waiver.