Hacker News Reader

> Typically no solder paste is used, just flux.

Ah, so reflow the solder on the package ends then? And I assume they have a fancy precision process for “tinning” the ends?

View on HN

The (more common) package has very precise solder bumps. You can have a special order for one with ENIG finish as well, but this only makes sense if you have a really good use case (using Pb solder, wirebonding directly). Not sure what method is used to deposit this solder. Probably just stencil on wafer before slicing.

Reply on news.ycombinator.com