So for years the "AT" and then "ATX" design has dominated personal computers. pushed by Intel as a way to create a serviceable framework for OEMs to create workable computers, all of the "tough" engineering challenges (like heat management) were "designed in" by the modularity constraints. Evolving as a unit, the x86 PC, the Processor, and power requirements (and later GPU requirements) all foisted their own compromises on the builders.
Now Apple had something pretty cool, they started with a platform that is designed for heat dissipation. Basically the entire central column does nothing but suck heat away from things attached to it. And they put a large diameter fan which can be quieter at the top.
Given that most of the things we used to think of as "interface cards" which attached to a bulky parallel bus are being built on top of serial buses, either USB, Thunderbolt, or PCIe. The ability to support the big hitters (CPU/Memory complex) and GPU complex, in addition to a "ports and I/O zone" would be welcome relief for PC makers if they had something similar.
There hasn't been a company, other than Intel, that had the reach to create a mass market form factor for a long time. The last serious change was when VIA created the ITX standard, and it was really pretty modest relative to the ATX standard at the time.
So whether or not you like the 'jet engine' look of the thing, it seems like it brings some nice innovation to the systems design table. I would love to see a generic equivalent that built in a thermal management system as nice as this one. By keeping the 'fins' on the other side of the boards, there is nothing to suck dust on to the circuit boards. And if you've ever cleaned a PC that was stuck under a desk in somebodies house for a few years you will probably find this a huge improvement.
All in all, I give it top marks. But I've yet to see it in person!