I was just thinking about the end of Moore's law. People in the industry will tell you they've been overcoming obstacles for decades, but there is a fundamental change going on. Previous obstacles were manufacturing: Reduced wavelength, double patterning, immersion lithography. Some were part manufacturing and part device change: SOI, strained silicon. But now we're seeing changes to the devices themselves: Tri-gate transistors and now IBMs SiGe material for 7nm.

That change to SiGe is to increase electron mobility. The material could have been used all along, but it has been easier to stick to the tried and true Si. The bottom line is that plain silicon is not really viable below 10nm. A material change to effect one parameter isn't likely to be useful for more than a node or two before the same problem arises in that material.

I'd say 14nm FinFET will be a long lived node just like 28 has been. Then 7nm SiGe will be a higher end node with higher cost. Perhaps there will be another at 5nm but that's going to be a long time.

The equipment manufacturers will need to stay in business so they'll start selling stuff cheaper to the lower cost players as development of new nodes stops. This will lead to more capacity at the advanced node. Every micro controller will be made at 28nm and have an FPU (I can finally abandon fixed point math). Every SoC with a GPU will be made at 14nm. And lastly, laptops and desktops will have 7nm parts that are very expensive due to the expense of different materials, light sources, and the number of masks.

That's my guess at the market over the next few years and lasting for at least 10 more years beyond that. It will be very interesting to see how all the players cope with this. Even ARM will suffer as their CPU license cost starts to become a problem in a world of cheap chip production.