The topic was replacing silicon. I'm sure there are niche applications for it, but having to seal everything helium-tight won't work for all use cases that are served by silicon chips.
You usually don’t want to expose anything to oxygen especially something that is only a few nanometers thick so even if the base silicon does not oxidize (which afaik it does) once you begin the doping process not to mention laying down the metal layers oxygen is a big no no, the oxide layer that form on say copper coins is thicker than the copper layers in most ICs so I really don’t see oxygen as being viable medium during manufacturing.
Based on this it seems that when Oxygen is used it’s used as a purge gas https://www.globalspec.com/learnmore/materials_chemicals_adh...