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Chiplets were for sure an amazing bet AMD made that’s paid off big time.

The smaller dies and modular setup even on the same die gives them so much flexibility in their binning and package integration and must keep defect rates much lower than Intel’s monolithic high core count chips.

And the 14nm I/O die means they can still keep buying chips from GloFo, whom they still have a contract with as part of the spinoff from a decade ago.

> But the chiplet architecture, supported by fast Infinity Fabric interconnect is what puts AMD ahead.

Exactly this. Funny Intel is no longer mocking this as dies "glued together".

Intel has some very impressive chiplet technologies in house, aka EMIB. It's surprising they haven't used it for anything but that weird 8809G yet, but I'm sure it'll be used in more products next year.