I didn’t phrase that well. I meant that the wafer wafer and panel level embedded technologies embedded the silicon die inside of cheaper epoxy, instead of building expensive silicon interconnect to integrate them on. They basically make a plastic wafer with a bunch of die in it. Then interconnect is built up on that.

Edit: the links below show solder balls. Today this technology is used for packaging, and has been used on chips in phones for years now. In the near future, we should be able to embed or surface mount passives and mechanical components, so maybe we don’t need the PCB.

https://www.semanticscholar.org/paper/3D-eWLB-%28embedded-wa...

https://www.semanticscholar.org/paper/Latest-material-techno...