That's even worse, frequent thermal shocks are not good for IC longevity.
ICs frequently passing zero degrees, which aren't packaged in completely water impermeable packaging like ceramics or metal are also having issues
ICs frequently passing zero degrees, which aren't packaged in completely water impermeable packaging like ceramics or metal are also having issues
Besides, couldn't they keep it at a stable -20 °C?
> ICs frequently passing zero degrees, which aren't packaged in completely water impermeable packaging like ceramics or metal are also having issues
Issues with condensation?
Well, that makes sense. So why can't they be packaged in metal or ceramics?
Money
> Sure, they'll last shorter, but at least they will work. Besides, couldn't they keep it at a stable -20 °C?
I can't say that. I'm not a thermal engineer
Also, aren't they already packaged in metal? On graphics cards, the dies are directly exposed.
Liquid nitrogen cooling can already get good results in overclocking, so it seems like it should work here too.