For instance, long signal traces have a lot of twists and turns to be as close together as possible while avoiding obstacles and satisfying the design rules. Sometimes these signals do strange things like switching from poly wires to metal wires and back just so they can be a bit closer. These micro-optimizations don't seem like ones a human would make.
Another thing I've noticed is between two revisions of the chip that have identical layout except for a few traces. On one chip a trace will have a jog that's two 90-degree turns. On the other chip, the same trace will have 45 degree bends. So the two traces are identical except for this short segment. I assume that the automated layout algorithm changed slightly, resulting in this change.
If the 45 degree one is the newer version, that might be a DFM optimisation - there is common folklore around PCB design that 90 or acute angles can cause various problems, with some hint of truth to it, but I suspect there are similar constraints in photolithography. If the sharp corner was causing yield losses, a newer revision would definitely address that.
https://en.wikipedia.org/wiki/Electromigration#Via_arrangeme...
Using the term “chip” to describe integrated circuits is amateurish.
[1] https://www.micron.com/foundation/semiconductors
[2] https://www.tsmc.com/english/dedicatedFoundry/technology/SoI...
[3] (pdf) http://download.intel.com/pressroom/kits/chipmaking/Making_o...
http://archive.6502.org/datasheets/mos_6501-6505_mpu_prelimi...
"but including an on-chip clock ... in addition to the on-chip clock"
https://dl.acm.org/doi/10.1145/1463891.1464005 https://dl.acm.org/doi/10.1145/1463891.1463961