That's the way it's going. Discrete logic transistors fell out of use once integrated circuits became mainstream. Hand-solderable PCBs are next on the chopping block.
Consider chiplets. The initial impetus for them was to improve yields. With lithography development becoming increasingly expensive, packaging is looking like a much better target. This further unlocks options to integrate memory and accelerators like GPUs as chiplets on silicon.
At the same time, the high-speed digital world is bending over backwards to overcome the challenges of woven PCBs. Between chiplets and hand-solderable PCBs are some more attractive options to integrate bare dies on different substrates at smaller scales.
Power modules have completely eliminated packaging altogether. The outsides are ferrite material, which also serves as the substrate, heat spreader, and EMI shield. The only thing holding them back is the PCB. The polymer matrix is a heat insulator, and the distance to the next part requires many capacitors. Even logic chip makers are doing thin-film deposition of ferrites on chips.
For a relatively low-spec gadget like a phone, why wouldn't you integrate all the electronics into one component? It's the economically viable thing to do for now. Then there's only one more step before the whole product is fused.
People take PCBs for granted, but they only exist to connect components that people wish were already connected.