It isn't complex at all. Take the average density (average of sram and logic), take the square root of that, and you have (barring a factor) the node.

The best way to understand the dimension is to look at the contacted gate pitchm2 pitchcell height,and take the square root. The pitches obviously make an area, the cell height sets the 'design' component. So you get a reasonably scaled number.

Putting it that way also clarifies technology. Why euv, to tighten contacted gate pitch. Why cobalt: to tighten up metal 2 pitch (without killing resistance). Why backside metal: lowers cell height. There is of course more to it, but it is a good way to coarsely understand

A good way to know if it is marketing is if someone talks about feature sizes instead of pitches. Patterning is done by pitch. For example, you don't do euv to make smaller features. You do it to make more complex layouts at tight pitch.