It's a multi-project wafer not a multi-project chip.
They cut the wafer apart into individual chips. There is one project on each chip.
This has been going on since the 1970s. It is a very well-understood process.
They cut the wafer apart into individual chips. There is one project on each chip.
This has been going on since the 1970s. It is a very well-understood process.
Over the past year they tried an experimental "multi-project chip" (first samples shipped 14 months ago). But the management engine was a requirement long before this happened.
GP seems to have edited their comment, but I can't edit mine (even though it is only 8 minutes old)