It’s not a step I’ve seen discussed very much, so it was kind of neat to see it discussed front and center in a lay article like this.
It’s not a step I’ve seen discussed very much, so it was kind of neat to see it discussed front and center in a lay article like this.
https://resources.pcb.cadence.com/blog/2023-the-planarizatio...
Not dissimilar to lens or mirror making, the process of grinding to a precise flatness. The key step here is bonding it to a glass carrier, presumably because otherwise it gets too thin to support itself.
See also the "reduced kerf diamond wire saw": technology critical to cheap solar panels is the ability to saw the boule into thinner and thinner pieces with less waste at each cut, like a big ham slicer.
It's just crazy how far down the scale we're tickling atoms these days.
Zero chance you could do it if a human had to touch the die/chip directly during those steps.
But clean room + vacuum pick and place machine? A matter of fine tuning, and it should work just fine.