But how can they patent this, as 3D chips have been built for decades already?
I mean, it is nice that they found out some properties (lower heat than expected), but you cannot patent that, I suppose.
I mean, it is nice that they found out some properties (lower heat than expected), but you cannot patent that, I suppose.
Chips have been multiple layers since the beginning practically but it was also laid out in a somewhat 2D fashion of ALU here, FPU there, cache somewhere else, but now they are stacking functionality so that is isn't so discrete, in a 2D space it would get a little fuzzy.
It isn't mind blowing ground breaking stuff but it is very cool. Evolutionary not revolutionary.
Perhaps given the difficulty of acquiring and (using?) ASML machines, Huawei is looking for alternative routes to get there. Innovative nevertheless.