When yields get better, manufacturer can just produce the lower tier chip directly.
That said, with Zen6 having 12 cores per chiplet, I wouldn't be surprised if they eventually end up designing a smaller chiplet with 6 cores and a dedicated small chiplet carrier. Or push 6 core SKUs to the APU side that doesn't use chiplets, Zen5 APUs already have specialized masks for some of their SKUs.
Each wafer is printed separately. They don't build new custom production line for each new design.