https://octavosystems.com/app_notes/osd335x-power-applicatio...
https://octavosystems.com/app_notes/osd335x-software-control...
the power consumption numbers for the OSD335x-SM will be similar.
175 karma · joined September 21, 2017
https://octavosystems.com/app_notes/osd335x-power-applicatio...
https://octavosystems.com/app_notes/osd335x-software-control...
the power consumption numbers for the OSD335x-SM will be similar.
https://octavosystems.com/app_notes/osd335x-power-applicatio... https://octavosystems.com/app_notes/osd335x-software-control...
Yes. The OSD335x-SM is a smaller and more optimized module than the original OSD335x. Based on customer feedback from the OSD335x, we optimized the pin out to ease routing and reduced the size to enable more space constrained applications (The OSD335x-SM is 60% smaller than a discrete implementation: https://octavosystems.com/2017/08/30/smaller-cheaper-pcbs/)
One other thing that I will mention is that the 21mm x 21mm form factor of the OSD335x-SM enables designs that would not be possible with other SOMs or discrete components since is 60% smaller than a discrete implementation.
This is just the second device in what we see is a large space for System-in-Package devices. Please contact us (https://octavosystems.com/contact/) if you would like to discuss plans and goals in more detail.
The OSD335x-SM uses the same power management solution as the BBB. The chip itself will consume less power than the BBB since it doesn't have all the additional peripherals.
We currently have stock as DigiKey and Mouser and will maintain stock. If you have additional questions on supply, feel free to contact us (https://octavosystems.com/contact/)
We do have other development boards for this processor (https://octavosystems.com/octavo_products/osd3358-sm-red/) more expensive, but more features.
There are still some issues around RTC. The PMIC that we use (TPS65217C) doesn't support RTC-only mode, so unfortunately, you will still probably want to use the discrete RTC to get the standby time you need.
Our company does "System-In-Package" which means we integrate bare die, packaged parts and passives on a substrate and then package it up so that it looks like a single BGA from a design / manufacturing standpoint. We source wafers from TI and package everything ourselves. Please feel free to visit the website and look around and let us know if you have any other questions.